Thermal Paste Compound Silicone For Cpu Heat Sink Heat Sink

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Thermal Paste Compound Silicone For Cpu Heat Sink Heat Sink

  • Syringe design, for easy operation.
  • Helps disperse the heat from CPU to heatsink effectively.
  • Suitable for: CPU heatsink or chip. High temperature resistance.
  • Non-toxic, tasteless, non-corrosive.
  • Type: silicone fluid with 20% metal oxide.
  • Primary Use: Thermal coupling of electrical/electronic devices to heat sinks.
  • Special Properties: High conductivity; low bleed; Stable at high temperatures.
  • Thermal conductivity: >1.829 W/m-k.
  • Thermal resistance: >0.123℃-in²/w.
  • Color: gold.
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